Intel partners with Applied Materials to speed up AI chips
The chipmaker will work at the new EPIC Center and in Oregon on 3D packaging
Intel announced on October 6, 2026, that it is collaborating with Applied Materials to accelerate the development of chipmaking innovations for artificial intelligence. The joint initiative focuses on next-generation transistors, interconnects, and advanced packaging technologies.
The work will bring together capabilities from Intel's research and development campus in Hillsboro, Oregon, and Applied Materials' new EPIC Center in Silicon Valley. Applied Materials scheduled the facility to be operationally ready in 2026, aiming to shorten the path from laboratory research to commercial manufacturing.
The project covers advanced logic nodes and 3D stacking packaging based on Intel's Foveros technology. The teams aim to improve interconnect density, power delivery, and thermal performance for computing platforms targeting agentic AI workloads.
The demand for AI computing is driving the need for major advances in performance, power efficiency, and packaging. Intel is focused on delivering those innovations and doing it in close collaboration with partners across the ecosystem.
Naga Chandrasekaran, Executive Vice President, Chief Technology and Operations Officer and General Manager of Intel Foundry, stated that speeding up research and development is critical to supporting the rapid expansion of AI infrastructure and serving foundry customers.
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