The collaboration integrates MIPI A-PHY connectivity directly into image sensors.
onsemi and Valens Semiconductor announced a collaboration agreement on 22 September 2026 to develop an automotive image sensor with integrated MIPI A-PHY connectivity. The project targets high-volume automotive camera applications in the 3-megapixel (3MP) segment.
The planned design incorporates Valens' connectivity technology directly into onsemi's image sensor. This integrated approach aims to reduce the component count required in vehicle camera architectures while supporting standard high-speed connectivity.
a more streamlined camera architecture that reduces component count, supports industry standards, and ultimately makes advanced vision systems easier to deploy.
According to the companies, most automotive image sensors currently operate between 1 and 3 megapixels. The new 3MP sensor addresses this volume market while helping automakers and Tier 1 suppliers upgrade to higher-resolution setups. Valens previously secured design wins for its standalone VA7000 MIPI A-PHY chipsets, and this partnership adds an integrated alternative.
The companies did not disclose financial terms or a commercial release date for the product.
Newsletter
Markets in your inbox, weekly
LATAM-focused analysis, investing ideas, and the week in finance.
Keep reading
