NXP and VIS open their first 300mm fab in Singapore

VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture formed in September 2024 by NXP Semiconductors and Vanguard International Semiconductor (VIS), marked the grand opening of its first 300mm wafer fab in Tampines, Singapore, on September 28, 2026.

The opening follows 22 months of construction after a groundbreaking ceremony in December 2024. The facility has entered risk production after processing its first sample lot with yields exceeding 99%. Volume production is scheduled to start in the first quarter of 2027, supporting process technologies from 130nm to 40nm for analog, mixed-signal, power management, and interposer applications.

By 2029, the automated smart manufacturing plant is projected to reach a monthly capacity of approximately 44,000 12-inch wafers and create around 1,600 jobs. The output will serve end markets including automotive, industrial, mobile, consumer, and high-performance computing.

Rafael Sotomayor, President and Chief Executive Officer of NXP, stated that the joint venture enhances the company's geographic resilience, supply control, and cost competitiveness while advancing its hybrid manufacturing strategy.