The software vendor rolled out agentic AI tools and high-density interconnects for advanced nodes.
Synopsys expanded its collaboration with semiconductor foundry TSMC on September 25, 2026. The partnership rolls out certified design flows and new intellectual property for advanced process nodes, including A14 flows and multi-die packaging.
Both companies introduced agentic AI capabilities within Synopsys design software. The tools target complex semiconductors used in artificial intelligence, high-performance computing and edge computing.
Synopsys and Alchip Technologies also published new technical results on ultra-high-density chip-to-chip interconnects, specifically focusing on 224G links designed for AI data center hardware.
The company noted strong customer adoption in complex architectures, reporting over 100 cumulative die-to-die IP design wins and more than 150 UCIe wins alongside record demand for hardware-assisted verification.
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