TSMC plans 3% to 6% wafer price increases starting in 2027

Taiwan Semiconductor Manufacturing plans to raise wafer foundry prices by 3% to 6% starting in 2027. The company is preparing the multi-year pricing adjustment as capacity remains tight for artificial intelligence demand and advanced packaging through 2030.

The largest price increases are planned for advanced process nodes used in high-performance computing and AI chips. The higher rates aim to help TSMC earn a return on heavy capital spending for its 2nm and other leading manufacturing facilities.

Because TSMC fabricates and packages chips for designers ranging from smartphone makers to AI accelerator developers, higher wafer rates can raise hardware costs across the sector. The price moves could also prompt rivals such as Samsung and Intel to adjust their own terms to compete for future AI programs.