Broadcom to unveil AI networking tech at OCP Summit
The company will feature Tomahawk 6 switches and co-packaged optics for clusters above 100,000 accelerators.
Broadcom announced on Thursday, October 8, 2026, that it will present its latest artificial intelligence networking solutions at the 2026 Open Compute Project (OCP) Global Summit. The event takes place from October 12 to 15 in San Jose, California.
The semiconductor and software company will highlight Ethernet switches, network interface cards, PCIe components, and integrated optics designed for Open Rack Version 3 (ORV3) systems. Featured hardware includes Tomahawk 6, Tomahawk Ultra, and Jericho 4 Ethernet switches, the Thor Ultra 800G and Thor 2 400G Ethernet NICs, and the third-generation TH6-Davisson Co-Packaged Optics portfolio.
Asad Khamisy, senior vice president and general manager of Broadcom's Core Switching Group, will deliver a keynote on Monday, October 12, focusing on open networking, optical interconnects, and modular rack designs built for clusters exceeding 100,000 accelerators. Broadcom will also collaborate with more than 15 partner companies, including Accton, Alpha Networks, Celestica, Delta Electronics, and Micas Networks, to demonstrate hardware such as the Tomahawk 6-Davisson 102.4T co-packaged optics system across the exhibition floor.
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