ASML and Zeiss say Hyper NA chip tech may take 10 years

ASML Holding N.V. and optics partner Carl Zeiss SMT announced that their next-generation chipmaking technology, known as Hyper NA, could be ready in approximately 10 years. The projection was detailed in a joint research paper published in the Journal of Micro/Nanopatterning, Materials and Metrology and reported by Reuters on October 8, 2026.

The Hyper NA platform aims to achieve an optical numerical aperture of 0.75, compared to 0.55 on current High NA extreme ultraviolet systems. The design reuses the existing 13.5-nanometer light source wavelength while enabling a minimum printable half-pitch feature size of 5 nanometers. That represents a 33.3% reduction in circuitry feature size relative to High NA EUV tools, though it also brings an estimated 50% reduction in depth of focus that poses an engineering constraint.

The long-term roadmap emerges as major semiconductor manufacturers continue rolling out current High NA equipment. Both Samsung Electronics and SK Hynix target 2028 to implement High NA EUV systems, with Samsung deploying them into high-volume DRAM memory production. Taiwan Semiconductor Manufacturing Co. plans to introduce High NA EUV into advanced-node manufacturing in 2030.

Shares of ASML rose 1.3% intraday on the NASDAQ exchange following the news, trading at $1,828.35 on October 8, 2026.