ASML Partners With Clients on Data Chips
The company aims to expand High NA EUV tool capacity with larger masks by 2033.
ASML announced that it will develop its most advanced chipmaking tools in partnership with major clients. The initiative aims to enable the manufacturing of high-performance data center chips designed by companies like Nvidia and Google.
The project centers on adopting larger masks for next-generation High NA EUV machines. Standard EUV tools from ASML can print chips measuring up to 800 square millimeters, which fits today's largest data center chips. While existing High NA EUV systems etch finer features, their smaller masks restrict the physical size of completed dies.
Customer adoption remains gradual across the semiconductor sector. Intel uses High NA EUV tools for laptop processors, while TSMC plans to introduce the technology for high-volume manufacturing on advanced nodes starting in 2030. Samsung Electronics projects adoption for mass production of DRAM memory chips by 2028, and SK Hynix is evaluating participation in a 12-inch mask consortium with a target to apply High NA EUV to DRAM in 2028.
ASML expects to present a pilot line using the larger masks by 2031, with high-volume manufacturing readiness targeted for 2033.
Se conseguirmos viabilizar isso como indústria, veremos a produtividade desses sistemas crescer 40%.
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