ASML Wins Key Orders From TSMC and Samsung

On 8 September, Samsung and TSMC committed to using ASML's High NA extreme ultraviolet lithography machines to meet rising demand for advanced chips. The equipment prints smaller and more intricate circuit patterns onto silicon wafers, with each machine costing around $400 million.

Samsung plans to use the machines to manufacture DRAM memory starting in 2028 and expects broader adoption in 2030 to extend its roadmap and improve efficiency. TSMC said it will deploy the tools for advanced chips, expecting usage to grow as artificial intelligence applications require more complex transistor architectures.

Both companies join Intel, which ASML confirmed in July is using the High NA technology. TSMC and Samsung will also collaborate with ASML on developing next-generation 12-inch photomasks to replace the current 6-inch format, a shift that ASML said improves productivity and lowers costs.

ASML plans to expand total EUV capacity by about 30% in 2027. Barclays called the news positive and noted that demand may push ASML to expand capacity even further. ASML shares in Amsterdam traded flat to lower on the news, following a 120% gain over the past year.